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UID:23@hpc-ai-society.org
DTSTART;TZID=America/Chicago:20230831T113000
DTEND;TZID=America/Chicago:20230831T140000
DTSTAMP:20240206T180543Z
URL:https://hpc-ai-society.org/Events/shpcp-august-2023-lunch-learn/
SUMMARY:SHPCP August 2023 Lunch & Learn and TACC Tour
DESCRIPTION:\n\nDon't miss this Society of HPC Professionals lunch and lear
 n event\, including tour of TACC supercomputing facility!\n&nbsp\;\n\n\n\n
 \n\nSingle Phase Liquid Immersion Cooling: The Path to Cooling 1\,000 Watt
  Chips and Beyond\nBen Smith\, Chief Product Officer\, GRC\n31 August 2023
 \n11:30am- Noon CDT -- Networking\nNoon - 1:00pm CDT -- Presentation (+ on
 line option)\n1:00- 2:00pm CDT -- TACC Tour\nTexas Advanced Computing Cent
 er (TACC) + Online option\n10505 Exploration Way\nAustin\, TX 78758\n&nbsp
 \;\n\n\nDownload presentations and/or watch videos\n[membership level="1\
 ,2" show_noaccess="true"]\n Download 'Path to immersion cooled 1000W CPUs'
  presentation\n Download 'GRC Product Overview' presentation\n\n Watch vid
 eo\n\n[/membership]\n\n&nbsp\;\n\n\nAbout the Event\nServer and chip techn
 ologies continue to increase in power and speed. But these increases in pe
 rformance also mean the servers of today (let alone tomorrow) generate mor
 e heat than ever before\, with no signs of slowing down. As power consumpt
 ion and heat generation continue to rise\, the hot topic of discussion amo
 ng data center owners and operators and others in the data center ecosyste
 m is clear: can current data center cooling technologies keep up?\n\nIn th
 is session\, GRC CPO (Chief Product Officer) Ben Smith will share how GRC 
 systems are cooling some of today's hottest chips and take a look into the
  likely evolution of the server and Single Phase Immersion systems for the
  next generations of chips.\n\nFollowing the presentation we will take a t
 our of the TACC supercomputing facility which has a mix of different syste
 ms using different cooling approaches\, including the latest from GRC.\n\n
 About the Speaker\nBen Smith\nChief Product Officer\, GRC\nA seasoned glob
 al leader\, Ben brings an impressive track record of executing business st
 rategy and driving strong growth. Prior to joining GRC\, Ben helped APC an
 d Schneider Electric develop transformative business initiatives that impr
 oved product quality\, supply chain efficiency\, and order-to-delivery lea
 d times. Most recently\, he served as Schneider Electric’s Vice Presiden
 t Data Center Cooling Systems.\n\nBen holds a BA degree from Castleton Uni
 versity (Castleton\, Vermont) and a MS degree in Industrial Engineering/Op
 erations Research from University of Massachusetts Amherst.\n\n\n\n\n\n&nb
 sp\;\nMembers: remember to login to see your free ticket option.\nNote: if
  you see a message to renew\, we have seen a glitch on some browsers. Clic
 k the renew link\, which will take you to your account page\, where you wi
 ll see if you are current. If you are\, simply navigate again to the event
  page and you should see your free ticket option.
CATEGORIES:SHPCP
LOCATION:Texas Advanced Computing Center (TACC) @ UT Austin\, 10505 Explora
 tion Way\, Austin\, TX\, 78758\, United States
X-APPLE-STRUCTURED-LOCATION;VALUE=URI;X-ADDRESS=10505 Exploration Way\, Aus
 tin\, TX\, 78758\, United States;X-APPLE-RADIUS=100;X-TITLE=Texas Advanced
  Computing Center (TACC) @ UT Austin:geo:0,0
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DTSTART:20230312T030000
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